Chips JU Calls 2026: Europeiska samverkansprojekt inom elektroniska komponenter och system (ECS)
Vinnova
Vinnova
31 Mar 2027
27 Mar 2026
Svenska (Swedish), English
Who this is for
Who can apply
Not stated by the source
Company size
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Where it applies
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Funding level
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Sectors
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What the programme says
Genom Chips Joint Undertaking (Chips JU), även kallat EU:s halvledarprogram, vill Vinnova finansiera europeiska samverkansprojekt inom elektroniska komponenter och system. Projektens tillämpningsområden ska vara mobilitet, energi, industriell digitalisering, digital infrastruktur och kommunikation, eller digitalisering inom jordbruk och skog, hälsa och samhälle. In English: Genom Chips Joint Undertaking (Chips JU), also known as the EU´s semiconductor program, Vinnova wants to finance European collaborative projects in electronic components and systems. The projects can be in areas such as mobility, energy, industrial digitalisation, digital infrastructure and communication, digitalisation in agriculture and forestry, health and society. Vad ni kan söka för: Deltagande i europeiska samverkansprojekt med inriktning på elektroniska komponenter och system (ECS). Vem kan söka: Svenska företag som uppfyller Vinnovas krav samt universitet, högskolor och forskningsinstitut. Hur mycket kan ni söka: Maximalt bidrag från Vinnova till enskilt stort företag, universitet, högskola och forskningsinstitut är motsvarande 750 000 €. Maximalt bidrag från Vinnova till små och medelstora företag är motsvarande 450 000 €.
The record
What the catalogue filed about this programme: who funds it, where it applies, and when it closes.
Funder
Vinnova
Source
Vinnova
Closes
31 Mar 2027
Published
27 Mar 2026
Languages
Svenska (Swedish), English
Source
Vinnova · 2026-00518
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